TL;DR: TSMC will start equipment installation at its largest CoWoS advanced packaging plant, AP8, in Southern Taiwan Science Park in April 2025, with completion by year-end. The plant will house ...

TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...

TSMC is also optimizing its packaging technologies, particularly CoWoS-L and CoWoS-R ... enable HBM4 memory subsystems a few years down the road.

This new generation of TSMC's CoWoS ™ test vehicles added a silicon proof point demonstrating the integration of a logic SoC chip and DRAM into a single module using the Wide I/O interface. TSMC's ...

The chiplet system also demonstrates for SoC designers an on-die, bi-directional interconnect mesh bus operating at 4GHz, and a chiplet design methodology connected by an 8Gb/s inter-chiplet ...