An RF+SiP device dramatically reduces SWaP while featuring an open-standard digital interface for tuning, monitoring, and control.
A new SiC manufacturing process for power MOSFETs enables increased die per wafer and improved on-state resistance.
Resistance soldering offers precision heating placement, heat control, minimal risk to adjacent components, and convenient operation.
A new LED driver enables lighting designers to standardize design on a single component type, thus streamlining inventory and ...
The new LED driver also features analog and PWM dimming of the LED current via a DIM pin and has a 1% reference Continue Reading ...
A new SiC manufacturing process for power MOSFETs enables increased die per wafer and improved on-state Continue Reading ...
Resistance soldering offers precision heating placement, heat control, minimal risk to adjacent components, and convenient Continue Reading ...
A new SiC manufacturing process for power MOSFETs enables increased die per wafer and improved on-state Continue Reading ...
A new SiC manufacturing process for power MOSFETs enables increased die per wafer and improved on-state Continue Reading ...
In most operational amplifier (op amp) circuits, the resistor tolerance and resistor temperature coefficient determine the gain accuracy and gain temperature drift (Figure 1 shows a typical circuit).
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