OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices
OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has ...
Business Wire6d
OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices
Stacking ICs also increases the proximity between circuit layers ... by combining a wide range of different analog ICs. “Applying OKI’s thin-film chiplet technology to the heterogeneous ...
Semiconductor Engineering5d
Advanced Packaging Moving At Breakneck Pace
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2025: So Many Possibilities
Closed, proprietary chiplet systems are already shipping from the big semiconductor ... “In the engineering and design space, AI/ML solutions will move from the digital to the analog and make a bigger ...
TMCnet7d
OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices
Stacking ICs also increases the proximity between circuit layers, increasing crosstalk ... analog solutions by combining a wide range of different analog ICs. "Applying OKI's thin-film chiplet ...
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Exploring the impact of advanced semiconductor packaging
The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...
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Arm’s Chiplet System Architecture eyes ecosystem sweet spot
Chiplet System Architecture (CSA) is a set of system partitioning and chiplet connectivity standards harnessed in a design ...
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The Industry’s First System Chiplet For ADAS, Drones And AI Arrives
But a few weeks ago, Cadence took things a significant step further, and actually architected, designed, and taped out what the company calls the industry’s first Arm-based system chiplet ...