Cadence said the system chiplet integrates Arm’s processor IP with its system, memory, and interconnect IP and PHYs in a single die. It’s also one of the first chiplets to comply with Arm's ...

Cadence's UCIe demo presents key features and interoperability support, and also discusses the future of chiplet technology in high-performance SoCs. Discover how the Universal Memory Interface ...

At 64 Gbps, the Gen3 IP delivers over 20 Tbps/mm in bandwidth density with ultra-low power and latency. The configurable ...

In the rapidly evolving semiconductor industry, chiplet technology is emerging as a transformative force, offering innovative solutions to many of the challenges faced by traditional monolithic System ...

and the Open Chiplet Economy. Wednesday sessions cover creating foundry-ready designs, getting the most from high-bandwidth memory (HBM), and system-technology co-optimization (STCO). Thursday ...

However high bandwidth memory, HBM, will likely experience considerable growth in 2025 as NVIDIA and other suppliers of chiplet-based AI devices expand production to meet anticipated demand.

It specifically addresses the Memory Wall – the fundamental problem that memory technology has fallen behind processor advances, and is holding back progress,” said Helen Duncan, CEO of Blueshift ...

August 08, 2023 -- Today, the UCIe Consortium announced the public release of UCIe™ (Universal Chiplet Interconnect Express™) 1. ... Meet UCIe Experts at Flash Memory Summit (FMS) The UCIe Consortium ...

SEOUL, South Korea, Dec. 12, 2024 /PRNewswire/ -- BOS Semiconductors, the Korean automotive fabless company, and Tenstorrent, an AI design company, are pleased to announce the first debut of ...