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Discussions also took place on next-generation advanced packaging technology (CoWoS-L) necessary for AI accelerator manufacturing, as well as processes that are nearing commercialization, such as ...
TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).
Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.
Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it ...
During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually enhance CoWoS-L ...