Broadcom has interest in Intel’s chip-design business, while TSMC is looking at the company’s factories.

A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

The UK-based chip designer pivots to selling its own chips, securing Meta as its first major customer, and challenging ...

Jessica Felix discusses how to navigate the intricate balance between performance and observability, and the challenges of ...

AMD announced yesterday that it would be talking about more details for its next-generation GPUs on February 28 ahead of an ...

The AI "arms race" has taken on a new dimension with DeepSeek, a high-end artificial intelligence system that directly ...

The semiconductor industry remains a critical pillar of technological innovation, powering everything from AI to high-performance computing. Click to read.

Q4 2024 Earnings Call Transcript February 12, 2025Vishay Precision Group, Inc. misses on earnings expectations.

NEW DELHI: The demand for semiconductors in India in the artificial intelligence (AI) era is likely to increase to 28 per cent by the end of 2026 ... in AI/ML acceleration is the most relevant ...

Traditional customer service at its end? As businesses look to expand beyond basic customer service, AI agents are transforming into comprehensive partners. Rather than merely responding to ...

Electrogenic MX-5 review on CAR magazine: click here to find out what happens when this soulful classic roadster gets a ...

The emergence of DeepSeek, a Chinese artificial intelligence (AI) startup, is positive for the overall development of AI and ...