Semiconductor Packaging News9d
Veeco Elevates Next-Generation MicroLED Production with Lumina MOCVD System
Veeco Instruments Inc. announced that PlayNitride, an industry leader in MicroLED technology, has qualified Veeco's Lumina® MOCVD system for production ... Veeco Instruments Inc. We search for ...
Semiconductor Packaging News11d
Astute Group and Wise-integration Announce EMEA Distribution Partnership
Astute Group and Wise-integration announced a strategic distribution partnership covering Europe, the Middle East and Africa (EMEA). Wise-integration's WiseGan® family ... Semiconductor Packaging News ...
Semiconductor Packaging News9d
AI Technology Completes Strategic Acquisition of Ormet Circuits Inc.
AI Technology (AIT) is pleased to announce the successful completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics ... AI Technology, Inc.
Semiconductor Packaging News12d
CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) ...
Semiconductor Packaging News12d
Global Trade Restrictions on Semiconductor Materials Intensify: TECHCET Offers Critical Market Insights
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Semiconductor Packaging News12d
ACM Research Strengthens Atomic Layer Deposition Portfolio
ACM Research, Inc. announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace tool. The tool has achieved process qualification ...
Semiconductor Packaging News9d
New TPSMB Asymmetrical TVS Diodes from Littelfuse Provide Superior Gate Driver Protection
Littelfuse, Inc. announced the launch of its TPSMB Asymmetrical TVS Diode Series, the first-to-market asymmetrical transient voltage suppression (TVS) diode specifically ...
Semiconductor Packaging News11d
ZEISS and HÜBNER bring advanced functionality to bus and train windows
With its holographic display technology, integrated into the window systems of buses and trains, ZEISS now offers greater comfort on public transit journeys. The ZEISS ... Carl Zeiss Meditec generated ...
Semiconductor Packaging News9d
DENSO and onsemi Collaborate for a Strengthened Relationship
DENSO CORPORATION and onsemi announced that they are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced ... Semiconductor Packaging News is ...
Semiconductor Packaging News9d
sureCore teams with Sarcina to package cryo chips
Further to sureCore's recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes, ...
Semiconductor Packaging News11d
Aehr Test Systems Secures Initial $10 Million in Orders for Production
We search for industry news so you don't need to. Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Semiconductor Packaging News11d
Silicon photics: accelerating growth in the race for high-speed optical interconnects
Silicon photonics continues to evolve rapidly, with its diverse applications signaling significant opportunities ahead. Over the next decade, key players are expected to emerge ... Semiconductor ...