Semiconductor Engineering5d
Chiplets: Where Are We Today?
Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...
The Industry’s First System Chiplet For ADAS, Drones And AI Arrives
There was once a time when only well-established industry heavyweights could design and build bleeding-edge chips. That is no ...
OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices
OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has ...
EDN18d
Keysight elevates chiplet design environment
Chiplet PHY Designer 2025 from Keysight offers simulation capabilities for UCIe 2.0 and support for the Open Compute Project Bunch of Wires (BoW) standard. Tailored to AI and data center applications, ...
EDN14d
Arm’s Chiplet System Architecture eyes ecosystem sweet spot
Arm has announced the availability of the first public specification drafted around its Chiplet System Architecture (CSA), a set of system partitioning and chiplet connectivity standards harnessed in ...
Business Wire12d
OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices
Stacking ICs also increases the proximity between circuit layers ... by combining a wide range of different analog ICs. “Applying OKI’s thin-film chiplet technology to the heterogeneous ...