OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices
OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has ...
Semiconductor Engineering5d
Chiplets: Where Are We Today?
Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...
Business Wire12d
OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices
Stacking ICs also increases the proximity between circuit layers ... by combining a wide range of different analog ICs. “Applying OKI’s thin-film chiplet technology to the heterogeneous ...
Apple rumored to kick off M5 chip production using TSMC performance-enhanced 3nm node
South Korean website claims that TSMC has started high-volume production of Apple's M5 processors using N3P fabrication ...
TMCnet13d
OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices
Stacking ICs also increases the proximity between circuit layers, increasing crosstalk ... analog solutions by combining a wide range of different analog ICs. "Applying OKI's thin-film chiplet ...
siliconsemiconductor13d
Exploring the impact of advanced semiconductor packaging
The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...
The Industry’s First System Chiplet For ADAS, Drones And AI Arrives
There was once a time when only well-established industry heavyweights could design and build bleeding-edge chips. That is no ...
EDN14d
Arm’s Chiplet System Architecture eyes ecosystem sweet spot
Arm has announced the availability of the first public specification drafted around its Chiplet System Architecture (CSA), a set of system partitioning and chiplet connectivity standards harnessed in ...