TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip on wafer on substrate (CoWoS) advanced packaging technology offered ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief ...

CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial ...

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at semiconductor ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually enhance CoWoS-L ...

Intel says its new Falcon Shores AI accelerator won't see the light of day, shifts its focus into next-gen Jaguar Shores ...

The revised road plan presents the 200 Series, which employs dual-die design produced using CoWoS-L technology. Systems in the 300 Series include single-die (CoWoS-S) and dual-die (CoWoS-L).

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip on wafer on substrate (CoWoS) advanced packaging technology ...