The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while achieving industry-leading silicon area footprint and power consumption.
Jan. 21, 2025 (GLOBE NEWSWIRE) -- Numem, an innovator focused on accelerating memory for AI workloads, will be at the upcoming Chiplet Summit to showcase its high-performance solutions.
SUNNYVALE, Calif., Jan. 21, 2025 (GLOBE NEWSWIRE) -- Numem, an innovator focused on accelerating memory for AI workloads, will be at the upcoming Chiplet Summit to showcase its high-performance ...
SUNNYVALE, Calif., Jan. 21, 2025 (GLOBE NEWSWIRE) -- Numem, an innovator focused on accelerating memory for AI workloads, will be at the upcoming Chiplet Summit to showcase its high-performance ...
BlueLynx PHY solutions support Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project (OCP) Bunch of Wires (BoW) interfaces. An optional link layer connects to on-die buses ...
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