US government has reportedly provided TSMC with alternatives on how to help the company in the US, including working with ...

A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

Taiwan's GlobalWafers said on Friday its investments in the United States were proceeding as planned as the company had not ...

Infineon Technologies AG announces its 200 mm silicon carbide (SiC) manufacturing capability, with initial product releases ...

KLA Corporation KLAC shares have surged 21.5% in the year-to-date period, outperforming the broader Zacks Computer & Technology sector’s rise of 2.6% and the Zacks Electronics - Miscellaneous Products ...

GlobalWafers Co (環球晶圓), the world’s third-largest silicon wafer supplier, yesterday said it did not receive any notification ...

Taiwan's GlobalWafers said on Friday it has not received any notifications indicating upcoming modifications to agreed ...

Gary Dickerson; President, Chief Executive Officer, Director; Applied Materials Inc Brice Hill; Senior Vice President, Chief Financial Officer and Global Information Services; Applied Materials Inc I ...

Reports indicate that the Trump administration is considering revising incentive agreements under the CHIPS and Science Act ...

A new growth cycle is expected to continue over the next three to four years, driven by demand in servers, automotive, ...

Critical IC mineral concerns; wafer shipments shrink; Europe bets big on AI; new ultrasonic cleaner; high-speed DRAM test; ...

China's rapid expansion in mature-node wafer foundries is reshaping the global semiconductor landscape and intensifying ...