Design-Reuse3d
How PCIe® Technology is Connecting Disaggregated Systems for Generative AI
PCIe technology is set to be leveraged as an important component in the AI infrastructure marketplace. According to the “PCI ...
Design-Reuse6d
GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
This collaboration highlights GUC's commitment to deliver comprehensive and innovative design solutions, enabling customers ...
Design-Reuse1d
Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles
TOYKO, SEMICON Japan Booth #2148, Dec. 10, 2024 – Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced that it has signed an agreement with Synopsys Inc., a leading ...
Design-Reuse4d
UCIe-A PHY for Advanced Package (x64) in TSMC (N7, N6, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and networking applications. The PHY’s flexible ...
Design-Reuse4d
UCIe-A PHY for Advanced Package (x64) in Samsung (SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and networking applications. The PHY’s flexible ...