Semiconductor Packaging News
The semiconductor industry is crucial for global growth sectors like AI, cloud computing, and defense. In response, the EU and U.S. have enacted "chips acts" to boost domestic production, aiming for semiconductor sovereignty by 2030 amid geopolitical tensions and market challenges. EE Times Europe. Chipzilla back on death row.
3D Packaging in Semiconductors Increased Trend for of Electric …
4 days ago · 3D Packaging in Semiconductors Increased Trend for of Electric Devices Drives Demand. The global 3D semiconductor packaging market, valued at $11 billion in 2023, is projected to reach $57.19 billion by 2034, growing at a 16.17% CAGR. Asia Pacific leads the market, while North America sees rising demand in high-performance computing and ...
Semiconductor Packaging News Technical Paper Index
This paper highlights several unique features of the stepper tool. Not only its satisfactory resolution and competitive throughput, the "PPS-8000" ... Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging ...
CHIPS Subsidy Boosts Advanced Packaging in U.S.
CHIPS Subsidy Boosts Advanced Packaging in U.S. Summary A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. EE TimesRead the Full ...
TSMC OIP 2024: Strong Partnerships Drive 3D Packaging
Oct 15, 2024 · TSMC OIP 2024: Strong Partnerships Drive 3D Packaging. Summary At the TSMC North America OIP Ecosystem Forum, advanced packaging technologies dominated, outshining gate-all-around transistors. TSMC’s OIP drives collaboration, optimizing 3D packaging and chiplet design to streamline integration and reinforce their market leadership position ...
How Big A Deal Is Aging? - semiconductorpackagingnews.com
4 days ago · How Big A Deal Is Aging? Semiconductor aging is raising concerns in safety-critical markets like automotive, as newer nodes magnify aging effects. Experts emphasize the need for conservative design, thorough analysis, and additional margins to ensure reliability, with stress factors like voltage and temperature accelerating degradation.
Is Chip Packaging the New Front on the US-China CHIP WARS?
Scott Foster's Asia Times article emphasizes that advanced IC packaging is the new battleground in the U.S.-China chip wars. While U.S. sanctions target IC production, China's stronghold on back-end packaging complicates restriction efforts. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
New semiconductor factories are rising in US, but billions in Chips …
New semiconductor factories are rising in US, but billions in Chips Act money has yet to flow: Summary Several new semiconductor factories are sprouting up in the United States as billions of dollars from the CHIPS Act remain untapped.
Intel Glass Core Substrate Update - Semiconductor Packaging News
Intel Glass Core Substrate Update. INEMI hosted a webinar spotlighting Glass Substrates for Advanced Packaging, showcasing Intel's pioneering work. Dr. Dilan Seneviratne and Dr. Gang Duan of Intel detailed the company's strategic focus on glass core substrates, integral to their Advanced Packaging roadmap unveiled in September 2023.
North American Semiconductor Equipment Industry Posts …
North America-based semiconductor equipment manufacturers posted $3.92 billion in billings worldwide in December 2021, according to the December Equipment Market Data ... SEMI. October 2, 2024. Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024. Powered by strong semiconductor demand across diverse ...
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